By Joe Kelly
That includes helpful enter from industry-leading businesses and highly-regarded specialists within the box, this first-of-its variety source bargains skilled engineers a finished knowing of the complicated themes in RF, SiP (system-in-package), and SoC (system-on-a-chip) creation trying out which are serious to their paintings related to semiconductor units. The booklet covers key size innovations for semiconductor equipment checking out and assists engineers in explaining those options to administration to assist cut back undertaking expense, time, and assets. in line with real-world event and choked with time-saving equations, this in-depth quantity bargains pros functional info on crucial themes that experience by no means been provided in one reference earlier than.
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Extra resources for Advanced Production Testing of RF, SoC, and SiP Devices
Therefore, S-parameters can be listed in a magnitude–phase notation or in real–imaginary notation. The more common way is to specify magnitude and phase. In RF and SoC testing, the phase is typically not of importance, and the test engineer concentrates only on the magnitude portion of the measurement. Because S-parameters are obtained by dividing two numbers of the same units (volts), S-parameters themselves do not have a unit. However, instead of simply showing S-parameters as a number without units we translate those ratios into a logarithmic scale and therefore talk about S-parameters in decibels (dB).
Other standard specific tests that require modulated signals are ACLR [commonly performed for code division multiple access (CDMA) devices], bit error rate tests (commonly performed on Bluetooth devices), or error vector magnitude (EVM), which is frequently measured on devices that use orthogonal frequency division modulation (OFDM) such as Worldwide Interoperability for Microwave Access (WiMAX). A device-specific test is a test that is not performed because it is required according to the IEEE specification, but performed by the vendor to guarantee correct design of the device.
RF (Gigahertz) ATE Production Testing On-Wafer: Options and Tradeoffs,” Proc. 1999 Int. , 1999, p. 388. , and R. Grewal, “Microwave Electronic Calibration: Transferring Standards Lab Accuracy to the Production Floor,” Microwave Journal, Vol. 37, No. 9, 1994, pp. 94–105. , “Techniques Optimize Calibration of PCB Fixtures and Probes,” Microwaves & RF, Vol. 34, No. 11, 1995, pp. 93–98. , “Error Models for Systems Measurement,” Microwave Journal, Vol. 22, No. 5, 1978, pp. 63–66. Concepts of Production Testing of RF, SoC, and SiP Devices 19  Agilent Technologies, “Ultra Wideband Communication RF Measurements,” Application Note 1488, 2004.
Advanced Production Testing of RF, SoC, and SiP Devices by Joe Kelly